Today Hollingsworth & Vose introduced ViaMat aramid paper, a new nonwoven organic reinforcement material for electronic packaging. The new ViaMat paper delivers improvements in dimensional stability and enables higher interconnect densities.

“ViaMat paper fills the void created by the technical limitations of woven glass in advanced high-performance electronic packaging applications,” said Nate Burnes, business manager for Advanced Fiber Nonwovens (AFN) at H&V.

For manufacturers of PCBs on woven glass reinforcement, ViaMat paper provides an opportunity to expand their product offerings into high performance electronics applications such as avionics, portable electronics, medical devices and high capacity servers.

H&V’s new ViaMat nonwoven aramid paper features extreme surface smoothness for uniform resin application and low CTE (Coefficient of Thermal Expansion) for excellent dimensional stability as aramid fibers exhibit a negative CTE and restrain expansion of applied resins. Saturation of ViaMat paper can be processed on most existing glass resin saturation lines with minimal capital investment. According to H&V, the new product’s excellent laser/plasma ablation and drillability allow for increased interconnect density over industry standard woven materials.